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A method for heating an integrated circuits in the case of low temperatures and devices using the method

机译:在低温情况下加热集成电路的方法以及使用该方法的装置

摘要

A method for heating an integrated circuit (ic) can be a measuring a temperature of the ics, a comparing the measured temperature with a reference temperature and the generation of a comparison signal; and an activation of a heating element, the the ic is heated on the basis of the comparison signal have. An integrated circuit can have a temperature sensor, which is configured in such a way that it measures a temperature of the ics, the measured temperature with a reference temperature and compares a reference signal is generated. The ic can be a heating element, which is configured in such a way that it can be activated by the ic based on the comparison signal to be heated. An integrated circuit can have a heating element and a temperature sensor. The sensor can be configured in such a way that it measures a temperature of the ic and a control signal based on the measured temperature and generates a reference temperature. The element on the basis of the control signal can be activated in order to heat the ic, or the heating of the ics can be deactivated.
机译:加热集成电路的方法可以是测量集成电路的温度,将测量的温度与参考温度进行比较,以及产生比较信号。并激活加热元件,根据比较信号ic对ic进行加热。集成电路可以具有温度传感器,该温度传感器被构造为使得其测量集成电路的温度,所测量的温度与参考温度并且比较参考信号。 ic可以是加热元件,其被配置为使得它可以基于待加热的比较信号由ic激活。集成电路可以具有加热元件和温度传感器。传感器可以被配置为使得其测量ic的温度和基于所测量的温度的控制信号并产生参考温度。基于控制信号的元件可以被激活以便加热集成电路,或者集成电路的加热可以被禁用。

著录项

  • 公开/公告号DE102012112123A1

    专利类型

  • 公开/公告日2013-07-25

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号DE201210112123

  • 发明设计人 SHIN KYU PARK;MI SOOK KIM;

    申请日2012-12-12

  • 分类号H01L23/62;H01L23/34;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 16:21:51

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