SOLDER JOINT STRUCTURE AND SOLDER JOINTING METHOD

摘要

PROBLEM TO BE SOLVED: To rigidly joint a copper pin with an aluminum wire.SOLUTION: A solder joint structure comprises: a rectangular or circular columnar metal pin 26; an aluminum wire 27 having a winding part 271 wound around the metal pin; and a solder layer 28 for jointing at least one part of the metal pin and the winding part. At least one part of the winding part has a deformation face appearing by partial disappearance on a cross section vertical to a direction in which the aluminum wire extends, and the solder layer is close contact with the deformation face. On a cross section, aluminum grains might exist between the deformation face and a profile of an original shape of the aluminum wire. In many cases, the deformation face is opposed to the metal pin, and on the cross section, aluminum grains also exist between the deformation face and the metal pin.