ONE-SIDE POLISHING METHOD FOR SAPPHIRE WAFER, AND METHOD FOR PRODUCING SAPPHIRE WAFER

摘要

PROBLEM TO BE SOLVED: To provide a one-side polishing method for a sapphire wafer by which peeling of the sapphire wafer from a fixing member is suppressed and only the surface to be polished of the sapphire wafer can be suitably polished when the one-side polishing of the sapphire wafer is performed.;SOLUTION: The one-side polishing method for a sapphire wafer 15 has a step of installing a sapphire wafer in a fixing member, and a polishing step of polishing the surface exposed from the fixing member of the sapphire wafer 15 using polishing solution. The fixing member has: a ceramic plate 11; and a template 12 disposed in the one surface side of the ceramic plate 11, having the thickness thinner than that of the sapphire wafer 15, and provided with a plurality of through-holes for disposing the sapphire wafer 15 therein. In the sapphire wafer installation step, the sapphire wafer 15 is disposed in the through-hole provided in the template 12, and the sapphire wafer 15 is pasted on the surface of the ceramic plate 11 exposed from the through-hole by using wax 16.;COPYRIGHT: (C)2014,JPO&INPIT