Fixed abrasive pads for sapphire SiC glass and Si wafer polishing and a method for manufacturing the pad

摘要

Disclosed are a fixed abrasive grain pad for sapphire, silicon carbide, glass, and silicon wafer polishing and a manufacturing method thereof, which can increase a processing speed while solving a problem of an existing slurry method, and can maximally reduce scratches after the processing to acquire desirable roughness. The pad and the method comprise: a binder bonded to a surface of an abrasive grain and formed of resin; and a felt layer wherein a portion of the abrasive grain is inserted into the felt layer to be fixed by the binder, and the other portion thereof protrudes outwards. The felt layer is formed with animal hair, and the abrasive gain is inserted into the felt layer by using vacuum.