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FIXED ABRASIVE GRAIN POLISHING PAD, AND METHOD OF POLISHING SILICON WAFER USING FIXED ABRASIVE GRAIN POLISHING PAD
FIXED ABRASIVE GRAIN POLISHING PAD, AND METHOD OF POLISHING SILICON WAFER USING FIXED ABRASIVE GRAIN POLISHING PAD
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机译:固定磨粒抛光垫以及使用固定磨粒抛光垫抛光硅晶片的方法
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摘要
PROBLEM TO BE SOLVED: To provide a fixed abrasive grain polishing pad and a method of polishing a silicon wafer using the fixed abrasive grain polishing pad prevented from the detachment of abrasive grains and improved in polishing efficiency.;SOLUTION: This fixed abrasive grain polishing pad for polishing the silicon wafer by relative motion to the silicon wafer by pressing the silicon wafer while supplying an alkaline solution as a polishing fluid between the silicon wafer and the polishing pad, is composed of at least a polyurethane binder comprising a hard segment and a soft segment, and abrasive grains having a hydroxyl group, or abrasive grains supplied with the hydroxyl group, wherein the molecular weight of the hard segment is in a range of 20% to 60% of the whole at a molecular weight ratio.;COPYRIGHT: (C)2005,JPO&NCIPI
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