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The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer

机译：磨料大小对蓝宝石晶圆高压化学机械抛光的影响

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Chuljin Park; Hyoungjae Kim; Sangjik Lee; Haedo Jeong;
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年度 2015
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1. The Influence of Abrasive Size on High-Pressure Chemical Mechanical Polishing of Sapphire Wafer [J] . Park Chuljin, Kim Hyoungjae, Lee Sangjik, International Journal Precision Engineering Manufacturing-Green Technology . 2015,第2期

机译：磨料尺寸对蓝宝石晶片高压化学机械抛光的影响
2. Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes [J] . Zone-Ching Lin, Ren-Yuan Wang The International Journal of Advanced Manufacturing Technology . 2014,第1a4期

机译：通过具有不同磨料粒径的十字图案抛光垫抛光蓝宝石晶片的磨料去除深度
3. Investigation of Abrasive Removal Depth of Sapphire Wafer for Different Slurry Volume Concentrations of Chemical Mechanical Polishing with Cross Pattern Polishing Pad [J] . Lin Zone-Ching, Wang Ren-Yuan Journal of the Chinese Society of Mechanical Engineers, Series C: Transactions of the Chinese Society of Mechanical Engineers . 2015,第2期

机译：十字图案抛光垫化学机械抛光不同浆料浓度下蓝宝石晶片的磨料去除深度研究
4. Material removal regions in chemical mechanical polishing: coupling effects of slurry chemicals, abrasive size distribution and wafer-pad contact area [C] . Jianfeng Luo, Serdar Aksu, David A. Dornfeld Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference . 2002

机译：化学机械抛光中的材料去除区：浆料化学品，磨料尺寸分布和晶圆垫接触面积的偶联效果
5. Mechanics of the pad-abrasive-wafer contact in chemical mechanical polishing [D] . Bozkaya, Dincer 2009

机译：化学机械抛光中垫-磨料-晶片接触的力学
6. Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping [O] . Yong Hu, Dong Shi, Ye Hu, 2018

机译：超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
7. Abrasive Processing and Polishing Technology. Chemical Mechanical Polishing Technology for Silicon Wafer. [O] . Hisashi MASUMURA 1998

机译：磨料加工和抛光技术。硅晶片的化学机械抛光技术。

The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer

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