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Ag ball , Ag nuclear ball , flux -coated Ag balls , flux -coated Ag nuclear ball , solder joints , form solder , solder paste , Ag paste and nuclear Ag paste

机译:银球,银核球,涂有助焊剂的银球,涂有助熔剂的银核球,焊点,成型焊料,焊锡膏,银浆和核银浆

摘要

Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm 2 , a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.
机译:不论杂质元素的量是否等于或大于预定值(Ag除外),都应提供具有低α剂量和高球形度的Ag球。为了抑制软错误并减少连接故障,U的含量等于或小于5 ppb,Th的含量等于或小于5 ppb,纯度等于或大于99.9%,但是等于或小于99.9995%,α剂量等于或小于0.0200 cph / cm 2,Pb或Bi的含量或Pb和Bi的总含量等于或大于1 ppm,并且球形度等于或大于0.90。

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