首页> 外国专利> Ag BALL, Ag CORE BALL, FLUX COAT Ag BALL, FLUX COAT Ag CORE BALL, SOLDER JOINT, FOAM SOLDER, SOLDER PASTE, Ag PASTE AND Ag CORE PASTE

Ag BALL, Ag CORE BALL, FLUX COAT Ag BALL, FLUX COAT Ag CORE BALL, SOLDER JOINT, FOAM SOLDER, SOLDER PASTE, Ag PASTE AND Ag CORE PASTE

机译:Ag球,Ag核心球,助焊剂Ag球,助焊剂Ag核心球,焊料接头,泡沫焊料,焊料,Ag糊剂和Ag糊剂

摘要

PROBLEM TO BE SOLVED: To provide an Ag ball less in ray amount and high in sphericity even containing an excessive quantity of impurity element other than Ag.SOLUTION: There is provided an Ag ball having the content of U for reducing connection failure by preventing soft errors of 5 ppb or less, the content of Th of 5 ppb or less, purity of 99.9 to 99.9995%, ray amount of 0.0200 cph/cmor less, the content of any of Pb or Bi and the total content of Pb and Bi of 1 ppm or more, sphericity of 0.90 or more and diameter of 1 to 1000 m.
机译:解决的问题:提供一种即使含有过量的除Ag以外的杂质元素,也能够减少射线量,提高球形度的Ag球。解决方案:提供一种具有U含量的Ag球,通过防止软化来减少连接不良。误差在5 ppb以下,Th的含量在5 ppb以下,纯度在99.9%至99.9995%之间,射线量在0.0200 cph / cm以下,Pb或Bi的含量以及Pb和Bi的总含量1 ppm或更高,球形度为0.90或更高,直径为1至1000 m。

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