Method of manufacturing a circuit board, adhesive film with a metal film with film and the metal film

摘要

Offer the metal membrane equipped film and the metal membrane equipped adhesion film which it uses for the production manner, and the said manner of the circuit substrate which it is possible, to form with the metal membrane formation which is superior in adhesion and the uniformity for insulating formation and the said insulating formation efficiently furthermore, at the time of blind beer forming by the laser is superior in laser processability. Being the metal membrane equipped film which possesses the metal membrane formation which was formed on mold release formation and the said mold release formation which were formed on plastic film formation and the said plastic film formation, with respect to metal membrane formation of the metal membrane equipped film or the said metal membrane equipped film which features that 1 genera or more which are formed from water soluble resin of 1 genera or more, the surface where it touches at least with the metal membrane formation of the said mold release formation is chosen from water soluble cellulose resin, water soluble polyester resin and water soluble acrylic resin furthermore the said water soluble resin, are chosen from the metal chemical compound powder, the carbon powder, the metal powder and black dye are contained hardenabilityThe metal membrane equipped adhesion film where resin constituent formation is formed is used.