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How to set up the substrate processing apparatus , manufacturing method and substrate processing apparatus of a semiconductor device that is implemented by the substrate processing apparatus

机译:如何设置由该衬底处理设备实现的半导体器件的衬底处理设备,制造方法和衬底处理设备

摘要

PROBLEM TO BE SOLVED: To shorten a time required for a setup process when starting the operation of a substrate processing apparatus with a plurality of process furnaces.;SOLUTION: A method for setup of a substrate processing apparatus includes: connecting a test terminal, which includes a pseudo comprehensive control unit and a second operation unit, to a plurality of process furnace control units respectively with the process furnace control units PMC1, PMC2 being separated from a comprehensive control unit 90 and a first operation unit 100 respectively; transmitting a test operation command from the second operation unit to the plurality of process furnace control units through the pseudo comprehensive control unit; testing operations of the plurality of process furnaces PM1, PM2 in parallel by the plurality of process furnace control units receiving the process furnace test operation command; and transmitting a test operation report from the plurality of process furnace control units to the second operation unit through the pseudo comprehensive control unit.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:在开始具有多个处理炉的基板处理装置的操作时,为了缩短设置处理所需的时间。解决方案:一种基板处理装置的设置方法包括:连接测试端子,包括伪综合控​​制单元和第二操作单元,分别到多个处理炉控制单元,其中处理炉控制单元PMC1,PMC2分别与综合控制单元90和第一操作单元100分开;通过伪综合控制单元将测试操作命令从第二操作单元发送到多个处理炉控制单元;多个处理炉控制部,并行地对多个处理炉PM1,PM2进行测试动作,所述多个处理炉控制部接收处理炉测试动作指令。通过伪综合控制单元将测试操作报告从多个工艺炉控制单元传输到第二操作单元。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP5570775B2

    专利类型

  • 公开/公告日2014-08-13

    原文格式PDF

  • 申请/专利权人 株式会社日立国際電気;

    申请/专利号JP20090192373

  • 发明设计人 奥野 正則;

    申请日2009-08-21

  • 分类号H01L21/02;H01L21/677;

  • 国家 JP

  • 入库时间 2022-08-21 16:15:34

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