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Development of a High-Intensity UV Exposure Apparatus under a High-Pressure CO₂ Gas Atmosphere to Manufacture Large-Area Porous Ultralow-k Polyimide Substrates for Flexible Print Circuits

机译：在高压CO _{2 气体气氛下开发高强度紫外线曝光装置，用于制造用于柔性印刷电路的大面积多孔超级-K聚酰亚胺基材}

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Kentaro Taki; Hiroshi Ito;
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年度 2015
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1. Development of a High-Intensity UV Exposure Apparatus under a High-Pressure CO2 Gas Atmosphere to Manufacture Large-Area Porous Ultralow-k Polyimide Substrates for Flexible Print Circuits [J] . Taki Kentaro, Ito Hiroshi Journal of Photopolymer Science and Technology . 2015,第6期

机译：在高压CO2气体气氛下开发高强度紫外线曝光设备，以制造用于柔性印刷电路的大面积多孔超低k聚酰亚胺基板
2. Development of a High-Intensity UV Exposure Apparatus under a High-Pressure CO2 Gas Atmosphere to Manufacture Large-Area Porous Ultralow-k Polyimide Substrates for Flexible Print Circuits [J] . Kentaro Taki, Hiroshi Ito Journal of Photopolymer Science and Technology . 2015,第6期

机译：在高压CO2气体气氛下开发高强度紫外线曝光设备，以制造用于柔性印刷电路的大面积多孔超低k聚酰亚胺基板
3. Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer [J] . Taki Kentaro, Mizoguchi Akira, Ito Hiroshi Journal of Photopolymer Science and Technology . 2016,第3期

机译：用多孔聚酰亚胺层覆盖多孔聚酰亚胺柔性印刷电路
4. A UV-curable solder mask for flexible printed circuitry — From evaluation to manufacturing [C] . Gerald Fefferman Electrical Insulation Conference . 1977

机译：用于柔性印刷电路的可紫外线固化阻焊剂-从评估到制造
5. Creating and balancing process flexibility between uncertainty and opportunity: An empirical investigation of the printed circuit board manufacturing industry. [D] . Sawhney, Rajeev. 2000

机译：在不确定性和机会之间创建和平衡过程灵活性：对印刷电路板制造行业的实证研究。
6. Organo-soluble Polyimides and Their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards [O] . Junichi Ishi, Tomoyasu Sunaga, Mamiko Nomura, 2008

机译：有机可溶的聚酰亚胺及其在柔性印刷电路板中的光敏覆盖层材料的应用
7. Production Process Development for Polyimide-Acrylic Materials for Flexible Printed Circuitry. [R] . hays,stephen a. smith,walter a. 1977

机译：柔性印刷电路用聚酰亚胺 - 丙烯酸材料的生产工艺开发。

Development of a High-Intensity UV Exposure Apparatus under a High-Pressure CO2 Gas Atmosphere to Manufacture Large-Area Porous Ultralow-k Polyimide Substrates for Flexible Print Circuits

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Development of a High-Intensity UV Exposure Apparatus under a High-Pressure CO₂ Gas Atmosphere to Manufacture Large-Area Porous Ultralow-k Polyimide Substrates for Flexible Print Circuits