Heating device, the substrate processing apparatus, substrate processing method and a method of manufacturing a semiconductor device

摘要

PROBLEM TO BE SOLVED: To reduce contact between a heating element and a heat insulator at the time of thermal expansion of the heating element and reduce damage of components constituting a heating device.;SOLUTION: A heating device comprises an annularly formed heating element, a heat insulator placed around the circumference of the heating element, and a fixing part which fixes the heating element onto an inner wall of the heat insulator. At least when the heating element is at a room temperature, the distance between the heating element and the inner wall of the heat insulator is set to be larger as it moves away from the fixing part.;COPYRIGHT: (C)2012,JPO&INPIT