Multi-layer wiring board low dielectric loss resin, resin composition, a prepreg and a multilayer wiring board

摘要

PPROBLEM TO BE SOLVED: To provide a low dielectric-loss resin composition which can be melted into a low-boiling point general-purpose solvent and is excellent in the process workability of a wiring substrate while maintaining excellent characteristics of polyphenylene ether. PSOLUTION: The multilayer wiring substrate low dielectric loss resin which is a copolymer composed of repeating units of a formula (1). The multilayer wiring substrate uses the resin. Wherein, X is the repeating unit of a specific formula, R1 and R2 are each a hydrocarbon group of C1, and n and m are each an integer of 1 or more. PCOPYRIGHT: (C)2006,JPO&NCIPI