Resin composition, low dielectric constant resin sheet, prepreg, metal foil laminated board, high frequency circuit board and multilayer wiring board

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which allows a high frequency circuit board having excellent dielectric properties to be obtained and has excellent workability, and a low dielectric constant resin sheet, a prepreg, a metal foil-clad laminate, a high frequency circuit board and a multilayer wire board prepared therewith.SOLUTION: A resin composition comprises epoxy resin, curing agent, and fluorine resin filler. The fluorine resin filler has a content of 50-85 mass% relative to a solid content of the resin composition.SELECTED DRAWING: None