Flat die or the sputtering target of the flat die which possesses the sputtering

摘要

PROBLEM TO BE SOLVED: To provide a silver alloy based sputtering target with a large area, specifically, a flat sputtering target with an area of 0.3 m² or larger or a tubular sputtering target with a length of at least 1.0 m, which has less spark discharge hazard so that a sputtering process can be performed at comparatively high output density; and to provide a low-cost manufacturing method for the sputtering target.;SOLUTION: A silver based alloy has a crystalline structure having an average grain size of less than 120 μm; has an oxygen content of less than 50 mass ppm; has the contents of impurity elements of less than 0.5 mass ppm of aluminum, lithium, sodium, calcium, magnesium, barium, and chromium respectively; and has a metal purity of at least 99.99 mass%.;COPYRIGHT: (C)2014,JPO&INPIT