Lead/read pin equipped wiring substrate

摘要

P To provide a lead pin of a new structure which can be fixed ON a wiring board by reflow soldering with good reliability. PSOLUTION: A lead pin 10 has a shaft portion 12, and a connecting head portion 14 which is provided ON a tip end side of the shaft portion 12, has a diameter larger than a diameter of the shaft portion 12, and has an outer surface the whole of which is formed of a spherical surface. The shaft portion 12 and the connecting head portion 14 are formed from copper, a copper alloy and or kovar. A wiring board with a lead pin includes the lead pin 10 and a wiring board 20 equipped with a pin connecting portion S2. The connecting head portion 14 is made from an elliptic spherical shape having a lateral diameter longer than a vertical diameter and the connecting head portion 14 of the lead pin 10 is connected to the pin connecting portion S2 of the wiring board 20 through a solder layer 36. A diameter of the connecting head portion 14 of the lead pin 10 is set to be 40-80% of a diameter of the pin connecting portion S2 of the wiring board 20. PCOPYRIGHT: (C)2012 and JPO& INPIT