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Formation manner of the low temperature sintering Characteristic conductive paste and the electric conduction film and the electric conduction film which use that
Formation manner of the low temperature sintering Characteristic conductive paste and the electric conduction film and the electric conduction film which use that
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机译:低温烧结特性导电膏的形成方式以及使用该导电膏的导电膜和导电膜
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摘要
When it tries to utilize the substrate whose heat resistance is low, heat treatment in the 120 vicinity which deformation and the like does not occur is desired. In addition, if low it is possible with the type of resin which is used for the conductive paste to assure resistance conversion, the design of the paste which responds to purpose and it becomes possible, in addition field of application become wide. Then, being low temperature of the 120 whether the resin which is formed, is thermosetting metaplasia, or is heat plasticity die of with type, offer the conductive paste which can form the electric conduction film which reveals high conductivity. Being formation manner of the conductive film, carbon count the silver nano grain canning with the organic matter of 2 - 6, carbon count di-carboxylic acid 2 - 8 was added in the paste which is formed from dispersion medium and resin, it uses the conductive paste as the wiring formation paste.
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