首页> 外国专利> The crack of the mixed nitride of nitriding gallium or gallium and other metal which possess that the monocrystal formation which is not included, the production manner, and the electron or the photoelectron device

The crack of the mixed nitride of nitriding gallium or gallium and other metal which possess that the monocrystal formation which is not included, the production manner, and the electron or the photoelectron device

机译:具有不包括的单晶形成的氮化镓或镓与其他金属的混合氮化物的裂纹,制造方式以及电子或光电子器件

摘要

The invention concerns a monocrystalline coating crack-free coating of gallium nitride or mixed gallium nitride and another metal, ON a substrate likely to cause extensive stresses in the coating, said substrate being coated with a buffer layer and wherein: at least a monocrystalline layer of a material having a thickness ranging between 100 and 300 nm, preferably between 200 and 250 nm, and whereof crystal lattice parameter is less than the crystal lattice parameter of the gallium nitride or of the mixed gallium nitride with another metal and is inserted in the coating of gallium nitride or mixed gallium nitride with another metal. The invention also concerns the method for preparing said coating. The invention further concerns electronic and optoelectronic devices comprising said coating.
机译:本发明涉及氮化镓或氮化镓和另一种金属的单晶涂层的无裂纹涂层,该涂层在可能在涂层中引起广泛应力的基底上,所述基底涂覆有缓冲层,其中:一种材料,其厚度在100至300nm之间,优选在200至250nm之间,并且其晶格参数小于氮化镓或氮化镓与另一种金属的混合晶格参数,并被插入涂层中氮化镓或氮化镓与另一种金属的混合。本发明还涉及制备所述涂层的方法。本发明进一步涉及包含所述涂层的电子和光电装置。

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