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Structures for grounding metal shields in backside illumination image sensor chips
Structures for grounding metal shields in backside illumination image sensor chips
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机译:背面照明图像传感器芯片中金属屏蔽层的接地结构
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摘要
A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed on the front side of the semiconductor substrate. A dielectric layer is disposed on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate. A metal shield is over the dielectric layer and overlapping the photo-sensitive device. A metal plug penetrates through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate.
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