METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD FOR MANUFACTURING A BOND PAD OF A CHIP, A DIE ARRANGEMENT AND A CHIP ARRANGEMENT

摘要

A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.