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THIN FILM CONDENSER FOR HIGH-DENSITY PACKAGING, METHOD FOR MANUFACTURING THE SAME, AND HIGH-DENSITY PACKAGE SUBSTRATE INCLUDING THE SAME
THIN FILM CONDENSER FOR HIGH-DENSITY PACKAGING, METHOD FOR MANUFACTURING THE SAME, AND HIGH-DENSITY PACKAGE SUBSTRATE INCLUDING THE SAME
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机译:用于高密度包装的薄膜冷凝器,其制造方法以及包括其的高密度包装基质
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摘要
Provided are a thin film condenser for high-density packaging, a method for manufacturing the same and a high-density package substrate. The thin film condenser for high-density packaging, includes: a support substrate; a lower electrode formed on the support substrate; a dielectric thin film formed on the lower electrode; and an upper electrode formed on the dielectric thin film. Provided also is a method for manufacturing the same. The high-density package substrate, includes: at least two stacked substrates; thin film condensers embedded in the stacked substrates; an internal connection electrode formed in the stacked substrates and connecting the thin film condensers in series or in parallel; a surface electrode formed on the surface of the outermost substrate among the stacked substrates and connected to the internal connection electrode; and an integrated circuit connected to the surface electrode via a bump.
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