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Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method
Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method
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机译:形成无芯倒装芯片球栅阵列(FCBGA)基板的方法以及通过该方法形成的基板
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摘要
A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair of laminates, so that each laminate has an outer ball grid metal pad array, and during the depositing of the pair of laminates on the carrier substrate, further depositing a supporting layer of dielectric material enclosing the metal pad array, wherein said supporting layers of dielectric material provides structural support for each of the laminates after the separation.
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