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LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT
LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT
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机译:叠层陶瓷电子部件,其制造方法,串行贴装电子部件,其制造方法以及层状陶瓷电子部件的方向识别方法
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摘要
In a laminated ceramic electronic component, a side surface outer electrode circles around a ceramic element body, a first electrode portion includes a first side surface electrode portion on first and second side surfaces of the ceramic element body and a first wrap-around electrode portion extending from the first side surface electrode portion and wraps around portions of third and fourth side surfaces, and a second electrode portion includes a second side surface electrode portion on the third and fourth side surfaces and a second wrap-around electrode portion extending from the second side surface electrode portion and wrap around portions of the first and second side surfaces. External appearance configurations in which the first and second wrap-around electrode portions are recognizable from outside are provided to the first and second wrap-around electrode portions.
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