首页> 外国专利> LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT

LAMINATED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, SERIAL TAPING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND DIRECTION IDENTIFICATION METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT

机译:叠层陶瓷电子部件,其制造方法,串行贴装电子部件,其制造方法以及层状陶瓷电子部件的方向识别方法

摘要

In a laminated ceramic electronic component, a side surface outer electrode circles around a ceramic element body, a first electrode portion includes a first side surface electrode portion on first and second side surfaces of the ceramic element body and a first wrap-around electrode portion extending from the first side surface electrode portion and wraps around portions of third and fourth side surfaces, and a second electrode portion includes a second side surface electrode portion on the third and fourth side surfaces and a second wrap-around electrode portion extending from the second side surface electrode portion and wrap around portions of the first and second side surfaces. External appearance configurations in which the first and second wrap-around electrode portions are recognizable from outside are provided to the first and second wrap-around electrode portions.
机译:在层叠陶瓷电子部件中,侧面外电极围绕陶瓷元件主体环绕,第一电极部分包括在陶瓷元件主体的第一和第二侧面上的第一侧面电极部分以及延伸的第一环绕电极部分。从第一侧面电极部分开始,并围绕第三和第四侧面的一部分,第二电极部分包括在第三侧面和第四侧面上的第二侧面电极部分,以及从第二侧面延伸的第二环绕电极部分表面电极部分并缠绕在第一和第二侧面的部分周围。其中,从外部可识别第一和第二环绕电极部分的外观构造被提供给第一和第二环绕电极部分。

著录项

  • 公开/公告号US2014126106A1

    专利类型

  • 公开/公告日2014-05-08

    原文格式PDF

  • 申请/专利权人 MURATA MANUFACTURING CO. LTD.;

    申请/专利号US201314063077

  • 发明设计人 TAKASHI SAWADA;

    申请日2013-10-25

  • 分类号H01G4/01;H05K13/00;H05K13/02;

  • 国家 US

  • 入库时间 2022-08-21 16:04:20

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