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Wafer dicing using hybrid multi-step laser scribing process with plasma etch
Wafer dicing using hybrid multi-step laser scribing process with plasma etch
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机译:使用混合多步激光划片工艺和等离子蚀刻工艺进行晶圆划片
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摘要
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The mask is composed of a layer covering and protecting the integrated circuits. The mask is patterned with a multi-step laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the integrated circuits.
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