COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE USING COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED WIRING BOARD PRODUCTION METHOD

摘要

Provided is a copper foil with a carrier in which there are no limits to the types of ultra-thin copper layers and carriers, nor to the thicknesses of the copper layers and carriers, and in which warping of the copper foil is satisfactorily suppressed. The copper foil with a carrier is provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultra-thin copper layer laminated on the intermediate layer. The residual stress of the outer surface of the copper foil carrier, and the residual stress of the outer surface of the ultra-thin copper layer are both contraction stresses or are both tensile stresses.