COPPER FOIL WITH CARRIER, PRODUCTION METHOD OF COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE SHEET AND PRODUCTION METHOD OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier in which before a lamination step to an insulation substrate, the adhesion force between a carrier and an extra thin copper layer is high, and while after the lamination step to the insulation substrate, the adhesiveness between the carrier and the extra thin copper layer is lowered, the carrier and the extra thin copper layer can be easily peeled at the interface between the carrier and the extra thin copper layer and generation of a pinhole on an extra thin copper layer side surface is favorably suppressed.;SOLUTION: There is provided a copper foil with a carrier which comprises a carrier, an intermediate layer laminated on the carrier and an extra thin copper layer laminated on the intermediate layer, where the intermediate layer is constituted of a molybdenum-nickel alloy or a molybdenum-cobalt alloy or a molybdenum-iron alloy, the adhesion amount of molybdenum of the intermediate layer is 50 to 10000 μg/dm², the adhesion amount of nickel is 50 to 40000 μg/dm² when nickel is contained in the intermediate layer, the adhesion amount of cobalt is 50 to 10000 μg/dm² when cobalt is contained in the intermediate layer, and the adhesion amount of iron is 50 to 10000 μg/dm² when iron is contained in the intermediate layer.;COPYRIGHT: (C)2015,JPO&INPIT