ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE, ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, ADHESIVE FILM WITH DICING FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

The present invention provides an adhesive composition for a semiconductor device, an adhesive film for a semiconductor device, and an adhesive film with a dicing film, capable of producing a highly reliable semiconductor device with a small number of voids. The present invention relates to an adhesive composition for a semiconductor device with 0.2-0.6 loss tangent at 175 deg. C in relation to dynamic viscoelasticity measurement after heating at 175 deg. C for 1 hour.