PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT UTILIZING THE COMPOSITION METHOD FOR FORMATION OF RESIST PATTERN, AND PROCESS FOR PRODUCTION OF PRINTED CIRCUIT BOARD

摘要

Disclosed is a photosensitive resin composition comprising a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and at least one pyrazine compound selected from the group consisting of compounds each having a structure represented by formula (1), compounds each having a structure represented by formula (2) and compounds each having a structure represented by formula (3). [In formulae (1) to (3), R1 to R12 independently represent a univalent organic group containing an alkyl group, a cycloalkyl group, a phenyl group, a naphthyl group or a heterocyclic group, wherein R1 and R2, R3 and R4, R5 and R6, R7 and R8, R9 and R10, or R11 and R12 may be bound to each other and, together with two carbon atoms contained in a pyrazine skeleton, form a ring. In formula (2), X and Y independently represent an atom group that constitutes an aromatic ring formed together with two carbon atoms contained in a pyrazine skeleton and having a monocyclic or condensed polycyclic structure. In formula (3), Z represents an atom group that constitutes an aromatic ring having a monocyclic or condensed polycyclic structure and formed together with four carbon atoms contained in a pyrazine skeleton or a hetero ring.