MASK FOR BUMPING SOLDER BALL ON CIRCUIT BOARD AND SOLDER BALL BUMPING METHOD USING SAME

摘要

The present invention relates to a mask for bumping a solder ball on a circuit board and a solder ball bumping method using the same. According to one embodiment of the present invention, the mask for bumping a solder ball on a circuit board includes opening parts which provides a space where a solder ball is inserted and mounted on a solder pad; and a trench which provides an inflow space for the spreading of flux to the mounting part of the solder ball on the solder pad and is extended from at least one side of the circumference of the opening part. Also, a mask for bumping a solder ball on a circuit board and a solder ball bumping method are disclosed.;COPYRIGHT KIPO 2014