COMPOSITE METAL LAYER PROVIDED WITH SUPPORTING BODY METAL FOIL, WIRING BOARD USING THE COMPOSITE METAL LAYER, METHOD FOR MANUFACTURING THE WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE WIRING BOARD

摘要

Disclosed is an earth-friendly composite metal layer provided with a supporting body metal foil, whereby waste generated by manufacture of a wiring board is reduced. Also disclosed are a wiring board using the composite metal layer, a method for manufacturing the wiring board, and a method for manufacturing a semiconductor package using the wiring board. The composite metal layer provided with the supporting body metal foil is formed by laminating a plurality of metal layers, which are composed of a lowermost metal layer, i.e., the supporting body metal foil, and two or more metal layers, by having a peeling layer between the adjacent metal layers. The peeling strength between each metal layer (A), which is positioned between the lowermost metal layer and the uppermost metal layer, and a metal layer (B) adjacent to the metal layer (A) by having therebetween the peeling layer, which is formed on the upper surface of the metal layer (A), is smaller than the peeling strength between the metal layer (A) and a metal layer (C) adjacent to the metal layer (A) by having therebetween the peeling layer, which is formed on the lower surface of the metal layer (A).