Evaluation of multilayer printed wiring boards by metallographic techniques: An illustrated guide to the preparation and inspection of plated-through hole test coupons based on the requirements of Mil-P-55110D

摘要

This work is an illustrated handbook containing the rationale and procedure for the evaluation of multilayer printed wiring board construction integrity with respect to plated-through holes in accordance with the requirements of MIL-P-55110D, Printed Wiring Boards. It is intended as a practical aid for those concerned with determining the construction integrity of multilayer boards for high reliability applications. Photomicrographs of cross sectioned holes illustrate defect types, acceptable and unacceptable conditions, and methods of measurement. A procedure for specimen preparation is given, and appropriate paragraphs of the military specification are included and explained.