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Present and Future of Build-up PWB's-Their Possibility and Limitation. Evaluation for Any Layer Inner Via Hole Structure Multilayer Printed Wiring Board for Cellular Mobile Telephones.

机译：积累PWB的现在与未来 - 他们的可能性和限制。用于蜂窝移动电话的任何层内通孔结构多层印刷配线板的评估。

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Tomiyo EMA;
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年度 1999
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1. Blind via hole drilling for multi-layers printed wiring board using laser beam -comparison between aramid and glass fiber reinforced PWB- [J] . Toshiki Hirogaki, Eiichi Aoyama, Hisahiro Inoue, 材料 . 1999,第5期

机译：用于多层印刷配线板的盲通孔钻孔使用激光束 - 芳纶和玻璃纤维之间的比较加强PWB-
2. Blind via hole drilling for multi-layers printed wiring board using laser beam -comparison between aramid and glass fiber reinforced PWB- [J] . Toshiki Hirogaki, Eiichi Aoyama, Hisahiro Inoue, 材料 . 1999,第5期

机译：使用激光束对多层印刷线路板进行盲孔打孔-芳纶与玻璃纤维增强PWB之间的比较-
3. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压动态平行度对多层印刷线路板差异的影响-多层印刷线路板精密粘合技术的研究IV
4. A Method of Determining the Equivalent Thermal Conductivity of a Conductive Printed Wiring Board (PWB) Layer with a Quasi-Random Circular Hole Pattern [C] . Mark A. Palie International Conference on Advanced Packaging and Systems . 2002

机译：一种用准随机圆孔图案确定导电印刷线路板（PWB）层的等效导热率的方法
5. Large-area, low-cost via formation and metallization in multilayer thin film interconnection on printed wiring boards (PWB) [D] . Li, Weiping 1999

机译：印刷线路板（PWB）上多层薄膜互连中的大面积，低成本通孔形成和金属化
6. Present and Future of Build-up PWB's-Their Possibility and Limitation. Any Layer IVH Structure Multi-Layer Printed Wiring Board. [O] . Kazuaki SHIRAISHI 1999

机译：积累PWB的现在与未来 - 他们的可能性和限制。任何层IVH结构多层印刷线路板。
7. Evaluation of multilayer printed wiring boards by metallographic techniques: An illustrated guide to the preparation and inspection of plated-through hole test coupons based on the requirements of Mil-P-55110D [R] . Jellison, J. 1986

机译：通过金相技术评估多层印刷线路板：根据mil-p-55110D的要求制备和检查镀通孔测试试样的图解指南

Present and Future of Build-up PWB's-Their Possibility and Limitation. Evaluation for Any Layer Inner Via Hole Structure Multilayer Printed Wiring Board for Cellular Mobile Telephones.

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