A metallic bump structure without under bump metallurgy and a manufacturing method thereof

摘要

PURPOSE: A metallic bump structure without an under bump metallurgy and a method for manufacturing the same are provided to firmly bond a metal bump on the die of a semiconductor by forming an isolation layer on the upper side of an input/output(I/O) pad. CONSTITUTION: An isolation layer(18) and a copper foil(20) are successively arranged on the active surface of a semiconductor device. The via is formed on the isolation layer and the copper foil on the I/O pad(12). A thin metal layer which is connected to the copper foil in the via and the I/O pad is formed. A plating resist with an opening is formed on the upper surface of the copper foil in order to expose the via.