RESIN SHEET WITH COPPER FOIL, MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

carrier layer provided on the carrier layer thickness 0.5 ~ 5 thin layer of copper and an insulating resin layer formed on the copper foil layer and the insulating resin layer is brought into contact with the substrate , and then to , a copper foil attached to the resin sheet to peel off the carrier layer from the copper foil layer , wherein the insulating resin is a phenol -no novolac backbone of the cyanate ester resin and a copper foil adhered resin sheet comprising a polyfunctional epoxy resin . ;