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INSERT SOCKET FOR SEMICONDUCTOR COMPONENT INSPECTION
INSERT SOCKET FOR SEMICONDUCTOR COMPONENT INSPECTION
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机译:用于半导体组件检查的插入式插座
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摘要
The present invention relates to an insert socket for semiconductor device inspection and, more specifically, to an insert socket for semiconductor device inspection which stably compresses a semiconductor device formed on a unit carrier by using a latch member which is formed of first and second latches and folded. The insert socket for the semiconductor device inspection executes a normal test of the semiconductor device by adding a shock absorption member which absorbs the shock of the unit carrier and executes an accurate inspection by preventing the semiconductor device from being separated in the movement. An overall composition of the present invention comprises a main body which includes: a receiving unit to insert a unit carrier on the center; a lever mounting unit which is installed on both sides of the receiving unit; an installation groove which fixates a locking unit on the bottom of the lever mounting unit; and a mounting groove to construct a latch member which fixates the unit carrier on one side. The overall composition of the present invention comprises: the lever member which is integrally combined to the lever mounting unit; the locking member which is mounted on the lower side of the lever member and controls the operation of the lever member; a latch member which fixates and releases the unit carrier settled on the receiving unit; and the shock absorption member which is formed of a link in which front and back mounting units, a unit carrier supporting unit which is combined to the inner side of the front mounting unit by a pin and supports the lower side of the unit carrier, and a bourdon which is combined to the inner side of the back mounting unit by a pin and gives electricity of a coil spring added to the upper side. The shock absorption member is integrally combined to the mounting groove formed in the main body by a pin and absorbs a shock added to the unit carrier. The overall composition of the present invention comprises the unit carrier formed in the receiving unit.
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