A method for increasing the yield of high-density THE MANUFACTURE OF ELECTRONIC MODULE

摘要

A method for increasing yield in the manufacture of high-density electronic modules based on the formation of embedded passive components, direct mounting active elements (chips) and layering interconnects consisting in that before the manufacturing and assembly of electronic modules developing a modification circuit which is intended only for its testability characterized in that it allows through special process steps after the formation of passive and active elements mounted, is formed and before Niemi interconnect spend multifunctional probe monitoring performance of each item.