METHOD FOR CONVERTING matrix arrangement BALL OF FINDINGS FROM CIRCUITS lead-free solder in tin-lead OKOLOEVTEKTICHESKOGO COMPOSITION AND solder paste FOR ITS IMPLEMENTATION

摘要

1. A method for transformation matrix disposed ball pin chips from lead-free solder tin-lead okoloevtekticheskogo composition, characterized in that the chip matrix arranged with ball leads of lead-free solder based on tin and silver mounted on a flat substrate of non-wetting solder material, which is pre-coated through a metal stencil, in strict accordance with a matrix arrangement of ball pin chips certain dose solder paste having It incorporates high lead content, while providing alignment and contacting the ball pin and doses of solder paste further generate heat to a peak temperature of not more than 230 ° C and subsequent cooling delayed a certain time interval at a temperature above 180 ° C to form a crystallization process new ball pins larger okoloevtekticheskogo consisting of tin-lead solder composition close to the eutectic ternary alloy SnPbAg.2. A method according to claim 1, characterized in that for the matrix of ball terminals disposed chips from lead-free solder, pre-determined dose of solder paste mass with a high lead content, which composition is calculated from the weight and dimensions, the chemical composition of the lead-free solder ball terminals and the step of matrix arrangement on a chip, while taking into account the necessary and possible increase in the volume of the converted output of the ball lead calculated mass, tin and other components which should us to be brought into bessvi