bump-on-trace-link structure for flip-chip housings

摘要

A bump-on-trace-link structure, the a soldered contact with a lower volume, in order to achieve a conductive metal column and to connect a metal conductor, comprises a conductive metal column, which is a bond-surface having a width w_P , and a metal conductor, which is connected to a housing-substrate is provided, and an upper surface having a width w_T , where w_P greater than w_T is. The solder contact is bonded to the bond-surface in that, by means of the width w_P , and is mainly is wetted only at the upper surface of the bonded metal conductor train, in that predominantly only the upper surface over the width w_T is wetted.