ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEX Co2+ METAL ION REDUCER

摘要

PROBLEM TO BE SOLVED: To provide a solution for electroless deposition of platinum.SOLUTION: A solution for electroless deposition of platinum comprises: a Co2+ concentrated stock solution source 208 containing a Co2+ concentrated stock solution; a Pt4+ concentrated stock solution source 212 containing a Pt4+ concentrated stock solution; and a deionized water source 216 containing deionized water. A mixed electrolyte solution 232 of the Co2+ concentration stock solution and the Pt4+ concentration stock solution is formed a flow 220 from the Co2+ concentrated stock solution source 208 joined by a flow 224 from the Pt4+ concentrated stock solution source 212 and a flow 228 from the deionized water source 216. A method for performing electroless plating of platinum includes exposing a wafer 236 to the mixed electrolyte solution 232.