首页> 外国专利> RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS, RESIST FILM, RESIST-COATED MASK BLANK, PHOTOMASK AND METHOD FOR FORMING RESIST PATTERN USING THE RESIST COMPOSITION, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS, RESIST FILM, RESIST-COATED MASK BLANK, PHOTOMASK AND METHOD FOR FORMING RESIST PATTERN USING THE RESIST COMPOSITION, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

机译:用于半导体制造过程的抗蚀剂组合物,抗蚀剂膜,抗蚀剂涂覆的掩模坯料,光掩模以及使用该抗蚀剂组合物形成抗蚀剂图案的方法以及用于制造电子设备和电子设备的方法

摘要

PROBLEM TO BE SOLVED: To provide a resist composition for a semiconductor manufacturing process, which exhibits high sensitivity and resolution, small line edge roughness (LER), an excellent pattern profile, excellent temporal stability and little outgassing in a process of forming an ultrafine pattern having a line width of 50 nm or less.SOLUTION: The resist composition for a semiconductor manufacturing process contains a compound (A) expressed by general formula (I) below. In general formula (I), Rrepresents an alkyl group, a cycloalkyl group or an aryl group; Rrepresents a monovalent organic group; Rto Reach represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or a halogen atom, and Rand R, Rand R, or Rand Rmay be bonded to each other to form an aliphatic ring or an aromatic ring; and X represents an oxygen atom or a sulfur atom.
机译:要解决的问题:提供一种用于半导体制造工艺的抗蚀剂组合物,该组合物在形成超精细图案的过程中具有高灵敏度和分辨率,较小的线边缘粗糙度(LER),优异的图案轮廓,优异的时间稳定性和极少的脱气性解决方案:用于半导体制造工艺的抗蚀剂组合物包含由以下通式(I)表示的化合物(A)。通式(I)中,R表示烷基,环烷基或芳基。 R代表一价有机基团; RtoReach表示氢原子,烷基,环烷基,芳基或卤原子,并且RandR,RandR或RandR可以彼此键合形成脂族环或芳族环; X表示氧原子或硫原子。

著录项

  • 公开/公告号JP2015022074A

    专利类型

  • 公开/公告日2015-02-02

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20130148762

  • 发明设计人 TSUCHIMURA TOMOTAKA;SAKIDA KYOHEI;

    申请日2013-07-17

  • 分类号G03F7/004;H01L21/027;G03F7/038;G03F7/039;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:08

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