首页> 外国专利> RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS ; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION ; ELECTRONIC-DEVICE MANUFACTURING METHOD ; AND ELECTRONIC DEVICE

RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS ; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION ; ELECTRONIC-DEVICE MANUFACTURING METHOD ; AND ELECTRONIC DEVICE

机译:半导体制造工艺的抗蚀剂组成;使用所述抗蚀剂组合物的抗蚀剂膜,抗蚀剂涂覆的毛毯毛坯,光掩模和抗蚀剂图案化方法;电子设备制造方法和电子设备

摘要

In the line width 50nm ultra-fine pattern formation that follows, sensitivity and high resolution, line edge roughness (LER) provide a small and pattern shape and is excellent in stability with time, and out gas generation also resist composition for a small semiconductor manufacturing process do. (A) a resist composition for semiconductor manufacturing processes which contains a compound represented by the general formula (I). In the general formula (I), R 1 is, represents an alkyl group, cycloalkyl group or aryl group, R 2 represents a monovalent organic group. R 3 ~ R 6 are, each represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a halogen atom. However, also R 3 and R 4, R 4 and R 5, or R 5 and R 6 is to form a cycloaliphatic or aromatic ring in combination. X is an oxygen atom or a sulfur atom.
机译:在随后的线宽50nm超细图形形成中,灵敏度和高分辨率,线边缘粗糙度(LER)提供了较小的图形形状,并且随时间推移具有出色的稳定性,并且析出气体也成为用于小型半导体制造的抗蚀剂组合物过程做。 (A)用于半导体制造工艺的抗蚀剂组合物,其包含由通式(I)表示的化合物。通式(I)中,R 1 表示烷基,环烷基或芳基,R 2 表示一价有机基团。 R 3 〜R 6 分别表示氢原子,烷基,环烷基,芳基或卤素原子。但是,R 3 和R 4, R 4 和R 5,或R 5 < / Sup>和R 6 结合形成脂环族或芳族环。 X是氧原子或硫原子。

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