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Group III nitride semiconductor growth substrate, III-nitride semiconductor epitaxial substrate, III-nitride semiconductor device and a III nitride semiconductor free-standing substrate, as well as methods for their preparation
Group III nitride semiconductor growth substrate, III-nitride semiconductor epitaxial substrate, III-nitride semiconductor device and a III nitride semiconductor free-standing substrate, as well as methods for their preparation
PROBLEM TO BE SOLVED: To provide an epitaxial substrate for group-III nitride semiconductors, a group-III nitride semiconductor element, and a stand-alone substrate for group-III nitride semiconductors, which produce good crystallinity not only for AlGaN, GaN, and GaInN compositions having growth temperatures at or below 1,050°C but also AlxGa1-xN compositions for high-Al having high growth temperatures; a substrate for growing group-III nitride semiconductors for fabricating the same, and to provide a method of efficient fabrication thereof.;SOLUTION: At least a surface region 2 includes a crystal growth substrate 3 made of an aluminum-containing group-III nitride semiconductor, a single metal layer 4 formed on the surface region 2 and made of crystallized Zr or Hf, and an initial growth layer 5 formed on the single metal layer 4 and formed by at least one buffer layer made of AlxGa1-xN (0≤x≤1).;COPYRIGHT: (C)2011,JPO&INPIT
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机译:解决的问题:提供用于III族氮化物半导体的外延衬底,III族氮化物半导体元件以及用于III族氮化物半导体的独立衬底,其不仅对于AlGaN,GaN和Si具有良好的结晶性。生长温度等于或低于1050℃的GaInN组合物,以及具有高生长温度的用于高Al的Al x Sub> Ga 1-x Sub> N组合物;解决方案:至少表面区域2包括由含铝的III族氮化物半导体制成的晶体生长衬底3,该衬底用于制造该III族氮化物半导体并提供其有效制造方法。形成在表面区域2上并由结晶的Zr或Hf制成的单个金属层4,以及在单个金属层4上形成并由至少一个由Al x制成的缓冲层形成的初始生长层5。 Sub> Ga 1-x Sub> N(0le; x≤ 1).;版权:(C)2011,JPO&INPIT
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