Integrated circuit structure having through substrate via and method of forming integrated circuit structure having through substrate via

摘要

An integrated circuit structure includes a stack of two or more integrated circuit substrates. At least one of the substrates includes through substrate vias (TSVs) that individually include opposite ends. The conductive bond pad is adjacent to one of the edges on one side of the substrate. The conductive solder mass is adjacent to the other end protruding in the height direction on the other side surface of one substrate. Individual solder masses are bonded to respective bond pads on the immediately adjacent substrate of the stack. Epoxy flux surrounds individual solder masses. Epoxy materials that differ in composition from the epoxy flux surround the epoxy flux on individual solder masses. A method of forming an integrated circuit structure is also disclosed. [Selection] Figure 1