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Integrated circuit structure having through substrate via and method of forming integrated circuit structure having through substrate via
Integrated circuit structure having through substrate via and method of forming integrated circuit structure having through substrate via
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机译:具有衬底通孔的集成电路结构和形成具有衬底通孔的集成电路结构的方法
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摘要
An integrated circuit construction includes a stack of two or more integrated circuit substrates. At least one of the substrates includes through substrate vias (TSVs) individually comprising opposing ends. A conductive bond pad is adjacent one of the ends on one side of the one substrate. A conductive solder mass is adjacent the other end projecting elevationally on the other side of the one substrate. Individual of the solder masses are bonded to a respective bond pad on an immediately adjacent substrate of the stack. Epoxy flux surrounds the individual solder masses. An epoxy material different in composition from the epoxy flux surrounds the epoxy flux on the individual solder masses. Methods of forming integrated circuit constructions are also disclosed.
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