首页> 外国专利> TRANSFER DEVICE AND TRANSFER METHOD OF SUBSTRATE FOR DEPOSITING COMPOUND SEMICONDUCTOR FILM, AND DEPOSITION SYSTEM AND DEPOSITION METHOD OF COMPOUND SEMICONDUCTOR FILM

TRANSFER DEVICE AND TRANSFER METHOD OF SUBSTRATE FOR DEPOSITING COMPOUND SEMICONDUCTOR FILM, AND DEPOSITION SYSTEM AND DEPOSITION METHOD OF COMPOUND SEMICONDUCTOR FILM

机译:复合半导体膜沉积物的转移装置及转移方法,复合半导体膜的沉积系统及沉积方法

摘要

PROBLEM TO BE SOLVED: To provide a transfer device and a transfer method of a substrate for depositing a compound semiconductor film capable of automatically transferring a substrate for depositing a compound semiconductor film, by eliminating the impact of particles or the problem of transfer to the substrate rear surface or undesired deposition on the substrate rear surface.;SOLUTION: A transfer device 170 has a support 70 for supporting a substrate holder 40, a lifting member 91 capable of lifting and lowering a substrate at a substrate holding part 80 of the substrate holder 40, and a shield member 82 which is lifted and lowered with lifting and lowering of the lifting member 91, interposed between the substrate W and the lifting member 91 when the lifting member 91 receives the substrate, and shields a hole 81 into which the lifting member 91 of the substrate holder 40 is inserted, on the rear side of the substrate W when the substrate is held at the substrate holding part. In a state where the lifting member 91 is lifted, the substrate W is mounted on the shield member 82, or the substrate W on the shield member 82 is transported by a transport device 201.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种用于沉积化合物半导体膜的衬底的转移装置和转移方法,其能够通过消除颗粒的影响或转移到衬底上的问题而自动转移用于沉积化合物半导体膜的衬底。解决方案:传送装置170具有用于支撑基板支架40的支撑件70,能够在基板支架的基板保持部80上升降基板的升降部件91。如图40所示,在升降部件91收纳基板时,在基板W与升降部件91之间夹着随升降部件91的升降而升降的屏蔽部件82,并遮蔽升降用的孔81。当基板被保持在基板保持部上时,基板保持器40的部件91插入到基板W的后侧。在抬起提升部件91的状态下,将基板W安装在防护部件82上,或者将防护部件82上的基板W通过输送装置201进行输送。版权所有(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015002292A

    专利类型

  • 公开/公告日2015-01-05

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20130126826

  • 发明设计人 MORIZAKI EISUKE;KIMOTO HIROHISA;

    申请日2013-06-17

  • 分类号H01L21/677;H01L21/683;H01L21/205;C23C16/458;

  • 国家 JP

  • 入库时间 2022-08-21 15:29:12

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