Film roll for semiconductor device, method for manufacturing semiconductor device, and semiconductor device

摘要

PROBLEM TO BE SOLVED: To suppress a transfer mark to an adhesive film when a film for a semiconductor device in which an adhesive film with a dicing film is laminated on a separator at a predetermined interval is wound in a roll shape. To provide a film roll. A film roll for a semiconductor device in which a film for a semiconductor device is wound around a cylindrical winding core, and the film for a semiconductor device has a dicing film in which a dicing film and an adhesive film are laminated. The film roll for semiconductor devices which has the structure by which the adhesive film was laminated | stacked on the separator at predetermined intervals, and the tensile storage elastic modulus in 25 degreeC of a separator is 1 GPa or more. [Selection] Figure 1