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CHIP TO PACKAGE INTERACTION TEST VEHICLE AND METHOD FOR TESTING CHIP TO PACKAGE INTERACTION USING THE SAME
CHIP TO PACKAGE INTERACTION TEST VEHICLE AND METHOD FOR TESTING CHIP TO PACKAGE INTERACTION USING THE SAME
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机译:芯片与包装相互作用测试车辆以及使用相同方法测试芯片与包装相互作用的方法
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摘要
A chip to package interaction (CPI) test vehicle includes a chip including metal patterns contained in first and second sub-regions, respectively, and in which any one of the following comparable properties (a)˜(e) is the same among the first and second sub-regions, and another one of the properties (a)˜(e) is different among the first and second sub-regions: (a) size and shape of the sub-region, (b) metal density of the metal pattern, (c) type of the metal pattern, (d) distance between the sub-region and a center of the chip, (e) structure of the metal pattern.
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