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Copper pillar bump and flip chip package using same
Copper pillar bump and flip chip package using same
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机译:铜柱凸块和使用其的倒装芯片封装
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摘要
Electrically conductive pillars with a solder cap are formed on a substrate with an electroplating process. A flip-chip die having solder wettable pads is attached to the substrate with the conductive pillars contacting the solder wettable pads.
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