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SEMICONDUCTOR PACKAGE WITH PACKAGE-ON-PACKAGE STACKING CAPABILITY AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE WITH PACKAGE-ON-PACKAGE STACKING CAPABILITY AND METHOD OF MANUFACTURING THE SAME
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机译:具有叠装叠装能力的半导体包装及其制造方法
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摘要
A method of making a semiconductor package with package-on-package stacking capability is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The interposer provides primary fan-out routing for the chip whereas dual buildup circuitries formed on both opposite sides of the base carrier provides further fan-out routing and are electrically connected to each other by plated through holes to provide the package with stacking capacity.
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