首页>
外国专利>
MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AND METHODS FOR THE FABRICATION THEREOF
MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AND METHODS FOR THE FABRICATION THEREOF
展开▼
机译:包括图案化的模具附件材料的微电子封装及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Embodiments of microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the fabrication method includes printing a patterned die attach material onto the backside of a wafer including an array of non-singulated microelectronic die each having an interior keep-out area, such as a central keep-out area. The die attach material, such as a B-stage epoxy, is printed onto the wafer in a predetermined pattern such that the die attach material does not encroaching into the interior keep-out areas. The wafer is singulated to produce singulated microelectronic die each including a layer of die attach material. The singulated microelectronic die are then placed onto leadframes or other package substrates with the die attach material contacting the package substrates. The layer of die attach material is then fully cured to adhere an outer peripheral portion of the singulated microelectronic die to its package substrate.
展开▼